Innodisk Unveils the New “AI on Dragonwing” Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC

Taipei, January 6 ^th, 2026 — Innodisk, a primary globally AI remedy distributor, presented the commence of its fresh AI on Dragonwing computer series, established in partnership with Qualcomm Technologies, Inc[1] The front runner EXMP-Q911 COM-HPC Mini component supplies as high as 100 TOPS of AI effectiveness whereas maintaining reduced power intake and wide-temperature integrity from -40 ° C to 85 ° C. The Qualcomm Dragonwing ™ SoCs in addition gives durability improve with 2038, ensuring deal solidity for prolonged-term commercial releases. As the initial product inner Innodisk’s AI on ARM profile, the series opens up a brand name fresh phase for buyers looking for lasting and scalable ARM-based entirely Side AI options.

The AI on ARM profile notes a crucial turning point within the partnership in between Innodisk and Qualcomm. The effective framework of the Qualcomm Dragonwing ™ SoCs supplies unique AI reasoning covers inner stringent thermal and power restrictions in side atmospheres. Integrated with Innodisk’s massive internal capacities in motorist porting and outer combination, the AI on ARM line-up boosts the SoC’s abilities, making it a strong structure for commercial side AI releases. This fresh line-up in addition shows a deep co-pattern initiative from both companies, joining joint equipment– device design and early-stage gizmo understanding to require next-technology side knowledge.

This partnership fixate the EXMP-Q911 COM-HPC Mini component, powered by the Qualcomm Dragonwing ™ IQ-9075 cpu including an 8-core Kryo Gen 6 CPU and an Adreno 663 GPU, sustaining 100 TOPS of AI effectiveness. Mainly based entirely on specified examination possibilities[1], the EXMP-Q911 can make as high as 10 × greater AI reasoning FPS about the same components.

The EXMP-Q911 incorporates 36GB of LPDDR5X memory and 128GB of UFS 3.1 storage space, alongside with an abundant duty of user interfaces, consisting of PCIe Gen4, USB 3.2, twin 2.5 GbE LAN, twin DP1.2, MIPI CSI-2, CONTAINER FD, and much more, kipping down strong connection for portable, efficiency-traumatic side programs.

Beyond equipment, Innodisk reinforces its giving with device instruments, consisting of IQ Studio, an commence-source designer website on GitHub that gives BSPs, recommendation code, standard tools, and a committed area home for designers. These sources wait on rate up prototyping, screening, and gizmo combination. On top of that, Innodisk’s cloud-based entirely management system, iCAP, more boosts remote device and AI version management staunch with given side atmospheres.

Built on the portable COM-HPC Mini create active ingredient listed below the current PICMG requirements, the EXMP-Q911 gives next-technology expandability past COM Allege Mini and enhances OEM combination with faster pattern cycles. As a deployment-ready component, it will certainly additionally extremely nicely go to as quickly as ingrained right into potential customers’ self-designed company boards for smooth gizmo combination and reduced pattern initiative. For a completely maximized combination capacities, the component supplies also higher capability when coupled with Innodisk’s company boards and pre-validated peripherals, consisting of MIPI and GMSL ingrained cams with totally ported vehicle drivers for VLM and computer-vision AI, alongside with modular M. 2 augmentation cards for networking, storage space, and commercial I/O. This blend gives a prefabricated remedy for structured release.

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” With Innodisk’s fresh AI on Dragonwing series, we’re making industrialized side knowledge much more available and scalable for commercial potential customers,” recognized Anand Venkatesan, Elder Supervisor, Item Management and Head of Industrial Processors, Qualcomm Technologies, Inc. “By matching Qualcomm Dragonwing ™ SoCs with Innodisk’s in‑house device and peripherals, OEMs can rate up pattern and release with the effectiveness, effectiveness, and integrity they require– on today time and over the extended term.”

Searching in advance, Innodisk and Qualcomm Technologies will certainly strengthen their partnership staunch with recommendation styles, trial packages, and disappear-to-market campaigns. The item profile will in addition integrate Qualcomm’s Dragonwing ™ IQX and IQ8 SoCs and future ARM systems for commercial automation, issue discovery, AGV/AMR, cool city abilities, and a substantial array of upright markets.

[1] Trying out carried out utilizing the YOLOv10n version staunch with 10 simultaneous video clip streams both at 30W.

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Concerning Innodisk

Innodisk is a primary globally worth concentrating on AIoT options and industrial-grade memory and storage space. Headquartered in Taiwan, the company has actually securely developed a strong globally visibility. Because its creation in 2005, Innodisk has actually regularly safeguarded the greatest market piece in industrial-grade storage space and has actually been rated among the snuff out 10 globally service providers of business-grade memory components.

With the quick pattern of AI modern technology, Innodisk utilizes its massive capacities, informative point of views, and devoted team of specialists to customize optimal options for business. Abiding by the core belief of hardware-tool combination, Innodisk targets to spearhead the globally AIoT makeover. Via critical collaborations with business leaders, Innodisk makes every effort to help with the initial release of AIoT abilities, adding to the awareness of a vibrant globe.

For even more information concerning Innodisk’s items, innovations, and winning AIoT application instances, please go away to our internet associate product at https://www.innodisk.com/en/index.