Apple Inc.’s upcoming M5 line of Mac chips will certainly be used Taiwan Semiconductor Production Co.’s three-nanometer N3P procedure, 9to5Mac reported today. The magazine associated the details to Apple expert Ming-Chi Kuo, that has a record of efficiently forecasting item launches from the firm. It’s thought several of the upcoming M5 chips will certainly additionally utilize […]
The blog post Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technology showed up initially on SiliconANGLE.
发布者：Maria Deutscher，转转请注明出处：https://robotalks.cn/report-apples-m5-chips-will-use-tsmcs-n3p-process-and-2-5d-packaging-technology/
