3D chip stacking method created to overcome traditional semiconductor limitations

An unique power supply modern technology for 3D-integrated chips has actually been established by using a three-dimensionally piled computer style including refining systems positioned straight over heaps of vibrant arbitrary accessibility memory.

发布者:Dr.Durant,转转请注明出处:https://robotalks.cn/3d-chip-stacking-method-created-to-overcome-traditional-semiconductor-limitations/

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