SANTA CLARA, Calif.–( SERVICE CABLE)– #AdvancedPackaging– The 4th yearly Chiplet Top, the biggest seminar devoted to chiplets, today reported on its 2026 Best of Program Honors at the Santa Clara Convention Facility. The champions are: Siemens EDA for “Product Packaging: Style”– Their Innovator3D IC software application allows quick preparation and heterogeneous assimilation of ASICs and chiplets utilizing 2.5 D and 3D product packaging modern technologies. UCIe Consortium for “Connection and Interoperability”– Their UCIe 3.0 requirements supplies
发布者：Dr.Durant，转转请注明出处：https://robotalks.cn/chiplet-summit-announces-2026-best-of-show-award-winners/
