ORLANDO, Fla.–( COMPANY CABLE)– Fonon, a multi-market holding firm, R&D facility, devices developer and producer of innovative laser product handling systems for subtractive and additive production, highlights advantages of its BlackStar silicon wafer dicing system for applications in the semiconductor sector. Standard laser dicing difficulties consist of lowering product losses and lowering splits and thermal distortions at an efficient machining rate. Leveraging Fonon’s patente
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