Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System

ORLANDO, Fla.–(BUSINESS WIRE)–Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, highlights its position to leverage the growing demand for effective wafer dicing technology in the semiconductor industry with its BlackStar laser dicing system. According to research firm Astute Analytica, the global push towards digitalization, coupled with rising demand for consume

发布者:Dr.Durant,转转请注明出处:https://robotalks.cn/fonon-well-positioned-to-capitalize-on-wafer-dicing-market-growth-with-blackstar-laser-dicing-system-2/

(0)
上一篇 2 11 月, 2024
下一篇 2 11 月, 2024

相关推荐

发表回复

您的电子邮箱地址不会被公开。 必填项已用 * 标注

联系我们

400-800-8888

在线咨询: QQ交谈

邮件:admin@example.com

工作时间:周一至周五,9:30-18:30,节假日休息

关注微信
社群的价值在于通过分享与互动,让想法产生更多想法,创新激发更多创新。