Recap
MILPITAS, Calif. – Oct. 1, 2024 – Powered by solid semiconductor need throughout varied end applications, the international semiconductor product packaging products market is anticipated to begin a development cycle with a 5.6% substance yearly development price (CAGR) forecasted via 2028, SEMI, TECHCET and TechSearch International revealed today in their most current International Semiconductor Product Packaging Products Overview ( GSPMO) record. The record highlights AI as an anticipated development vehicle driver for sophisticated product packaging applications, regardless of presently reduced device quantities because of the freshness of the marketplace sector.
The GSPMO record offers thorough information and projections for substratums, leadframes, bonding cord and extra sophisticated product packaging products.
“After a tough 2023, which saw a 15.5% decrease in the semiconductor product packaging products market, our most current record projections a go back to development in 2024,” claimed Lita Shon-Roy, TECHCET head of state and chief executive officer. “The international product packaging products market is anticipated to surpass $26 billion by 2025 and proceed strong development via 2028.”
“Substratums make up a big part of the profits for the product packaging products market, and within the classification, FC-BGA substratums comprise most of the profits development,” claimed Jan Vardaman, head of state of TechSearch International. “The CAGR for flip chip BGA/LGA profits is anticipated to be 7.6% from 2023 to 2028. Various other crucial development locations consist of wafer-level product packaging (WLP) dielectrics and turn chip underfill. The laminate substratums sector is anticipated to expand 7.3% yearly in quantity, while leadframes and bonding cord are likewise anticipated to recuperate, expanding by 5.0% and 6.4%, specifically.”
The GSPMO 2024 record is developed to assist firms take advantage of arising fads, browse supply chain obstacles, and make notified choices in sourcing high-performance products.
Functions of the record consist of:
- Modern technology fads
- Regional market dimension and projection
- Five-year market projection to 2028
- Market dimension by item sectors in profits and systems
- Excel workbook documents summing up market info
- Distributor info and market share
To find out more on the record or to subscribe, go to SEMI Market Information or get in touch with the SEMI Market Knowledge Group (MIT) at [email protected]
Regarding SEMI
SEMI is the international sector organization attaching over 3,000 participant firms and 1.5 million specialists globally throughout the semiconductor and electronic devices layout and production supply chain. We increase participant cooperation on options to leading sector obstacles via Campaigning for, Labor Force Growth, Sustainability, Supply Chain Monitoring and various other programs. Our SEMICON presentations and occasions, innovation neighborhoods, criteria and market knowledge assistance progress our participants’ company development and developments in layout, tools, tools, products, solutions and software program, allowing smarter, quicker, much more protected electronic devices.
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发布者：Robots Team，转转请注明出处：https://robotalks.cn/global-semiconductor-packaging-material-market-outlook-shows-return-to-growth-starting-in-2024/
