Henkel’s answer to ultra-demanding electronics applications: the Bergquist TGF 10000 thermal gap filler

Henkel remains to drive advancement in thermal user interface products with the intro of Bergquist TGF 10000, an innovative fluid space filler that provides 10 W/mK thermal conductivity. Made for high-power applications where reputable warm dissipation is crucial, Bergquist TGF 10000 establishes a brand-new criteria for efficiency and flexibility throughout markets consisting of vehicle, telecoms, computer, customer electronic devices, and network facilities. Simpleness satisfies quality in a.

Review the complete tale at https://www.webwire.com/ViewPressRel.asp?aId=347753

.

发布者:Dr.Durant,转转请注明出处:https://robotalks.cn/henkels-answer-to-ultra-demanding-electronics-applications-the-bergquist-tgf-10000-thermal-gap-filler/

(0)
上一篇 10 12 月, 2025 10:18 下午
下一篇 10 12 月, 2025 10:18 下午

相关推荐

发表回复

您的邮箱地址不会被公开。 必填项已用 * 标注

联系我们

400-800-8888

在线咨询: QQ交谈

邮件:admin@example.com

工作时间:周一至周五,9:30-18:30,节假日休息

关注微信
社群的价值在于通过分享与互动,让想法产生更多想法,创新激发更多创新。