Extremely Dynamic 4DOF Piezo Wafer Stage for Inspection and Metrology, unusual from PI

Leveraging a protracted time of piezo nanopositioning skills experience, introducing at 2024 Semicon West

Auburn, MA – PI’s newest wafer inspection solution is in step with a hybrid kinematics manufacture, combining Piezo-Creep motors and piezo stacks to prevent both long dash back and forth and extremely dynamic, ultra-right motion. This integrated 4-DOF solution reduces tools complexity, integration efforts, prices, and dangers.

Piezo-Creep motors are self-locking at relaxation, including no servo dither and warmth, unlike other motion ways. The high bandwidth of the short-dash back and forth piezo stack actuators permits for dynamic monitoring and blunder compensation of external disturbances (e.g., from long dash back and forth XY wafer levels).

The 4DOF module may perhaps presumably honest for rotational wafer misalignment and takes wafer thickness and machine static characteristics into legend.

The high-stiffness manufacture of the Tip-Tilt power module provides extraordinarily speedily step and pick (https://www.roboticstomorrow.com/recordsdata/2024/07/09/extremely-dynamic-4dof-piezo-wafer-stage-for-inspection-and-metrology-unusual-from-pi/22843/10msec) and suppose steadiness (0.05µrad).

Extra recordsdata on Piezo Stage for Wafer Inspection & Metrology

PI’s superior manufacture experience and long experience as a dealer to top tier semiconductor producers and main system integrators enables us to realize and meet the high requires of the industrial, including reproduction precisely and meeting strict cleanroom necessities.

Industries Served

Semiconductors, Metrology, Optics, Photonics

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