Emphasizes: – – – • MOU authorized at CES 2026 to co-develop incorporated services for auto customized to arising markets. – – – – – • Hyundai Mobis to boost efficiency, effectiveness, and security for innovative chauffeur support systems utilizing the Snapdragon Adventure Flex system-on-chip. – – – – – • Business’ contract expands past ADAS advancement, with strategies to supply wider SDV services based upon Snapdragon auto innovations. – – – Hyundai Mobis and Qualcomm Technolog …
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发布者：Dr.Durant，转转请注明出处：https://robotalks.cn/hyundai-mobis-and-qualcomm-sign-comprehensive-agreement-to-collaborate-on-sdv-architecture-for-adas/
