MIPS to Present Software-First Physical AI Design Insights at Chiplet Summit 2026

SANTA CLARA, Calif.–(BUSINESS WIRE)– #AdvancedPackaging–Chiplet Summit, the industry’s largest chiplet event, today announced that MIPS, a GlobalFoundries company, will participate in Chiplet Summit 2026, February 17-19 at the Santa Clara Convention Center. Drew Barbier, VP Products at MIPS, will deliver a presentation titled “Safety-Critical Physical AI Applications Using RISC-V.” He will also be on the panel “Selecting the Right Chiplets for Your Edge Application.” In addition, Sam Grove, Head of Software and

发布者:Dr.Durant,转转请注明出处:https://robotalks.cn/mips-to-present-software-first-physical-ai-design-insights-at-chiplet-summit-2026/

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