As need expands for much more effective and effective microelectronics systems, sector is transforming to 3D combination– piling chips on top of each various other. This up and down split style can enable high-performance cpus, like those made use of for expert system, to be packaged very closely with various other extremely specialized chips for interaction or imaging. Yet engineers almost everywhere encounter a significant difficulty: just how to avoid these heaps from overheating.
发布者：Dr.Durant，转转请注明出处：https://robotalks.cn/new-chip-tests-cooling-solutions-for-stacked-microelectronics-2/
