Nordson Electronics Solutions Develops Solutions for Panel-level Packaging During Semiconductor Manufacturing

• June 11, 2025
• Nordson Electronic Devices Solutions

CARLSBAD, Calif. – June 10, 2025 – Nordson Electronic Devices Solutions, an international leader in trusted electronic devices producing innovations, has actually created a number of services for panel-level product packaging (PLP) throughout semiconductor production. In one certain instance, Nordson’s consumer, Powertech Innovation, Inc. (PTI) saw underfill returns boost to more than 99% as they intend to shift from wafers to panels in their production procedures. For information concerning this option created in late 2024 and 2025, download and install the study below: Client Success: Powertech Modern Technology Inc. (PTI) Advancements Panel Degree Product Packaging with Nordson.

PTI, among the globe’s leading OSAT (Outsourced Semiconductor Setting Up and Examination) firms, dealt with the Nordson applications group to establish a detailed PLP presentation that accomplished high-grade, void-free underfill results at range, making use of the industry-leading ASYMTEK Vantage Collection fluid giving system, outfitted with the ASYMTEK IntelliJet Jetting system. Nordson’s accuracy innovation alleviated warpage and enhanced liquid circulation while reducing cycle time by nearly 30%.

PLP provides a course to handling the intricacy of bigger pass away dimensions and higher-density styles while preserving manufacturability and expense performance as the semiconductor market shifts from 300-mm wafers to panels. PTI is allowing PLP applications that are made to fulfill the semiconductor market’s expanding needs to offer AI, high-performance computer (HPC), and chiplet-based styles.

Underfill has actually been critical in semiconductor product packaging because the fostering of flip-chips in the 1990s. As applications have actually ended up being much more requiring, specifically in high-performance CPUs, GPUs, and progressed styles like flip-chip and 2.5 D/3D ICs, the value of underfilling to improve mechanical dependability and thermal efficiency has actually expanded. Because the start, Nordson created technologies for underfill procedures as the market progressed from computer board, substratum, wafer, and currently panel applications.

Nordson’s supplier, Jetinn Global Tools Ltd., sustained the improvements talked about in this study by buying presentation tools and offering experienced technological assistance.