OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

TOKYO–( ORGANIZATION CABLE)– OKI Circuit Innovation (” OTC”; Head Of State: Masaya Suzuki; Head workplace: Tsuruoka City, Yamagata), the OKI Team published motherboard (PCB) business, has actually efficiently created 124-layer PCB modern technology for wafer assessment devices created for next-generation high data transfer memory, such as HBM (Note 1) installed on AI semiconductors. This is an about 15% boost in the variety of layers over traditional 108-layer styles. OTC is looking for to develop automation techno

发布者:Dr.Durant,转转请注明出处:https://robotalks.cn/oki-develops-124-layer-pcb-technology-for-next-generation-ai-semiconductor-testing-equipment/

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